An extensive investigation was conducted on the electronic system of the high-temperature guarded hot plate method thermal conductivity apparatus. It was observed that the electronic system had several issues, including large fluctuation range of temperature measurement data, prolonged measurement cycles, and inaccurate calculation of heating power, all of which negatively impacted the measurement repeatability of the apparatus. By designing a new generation of electronic systems for the high-temperature guarded hot plate method thermal conductivity apparatus, the thermocouple cold junction compensation temperature control structure and the heating circuit sampling resistor heat dissipation structure were constructed in the design of the new generation electronic system, which reduces the fluctuation range of temperature measurement data and improves the accuracy of heating power calculation. Moreover, the temperature measurement circuit was reconstruct by using dual temperature conversion chips to increase the conversion frequency of temperature measurement. The experimental results demonstrate that the measurement repeatability of the high-temperature guarded hot plate method thermal conductivity apparatus, after the electronic system enhancement, has significantly improved from ±3.67%~8.93% to ±2.69%~4.34% within the temperature range of 200 ℃~600 ℃. The new generation of electronic systems has markedly enhanced the measurement reliability of the apparatus, providing more reliable data support for the measurement of insulation materials at high temperatures. It is of great value in practical applications and is expected to promote the in-depth development of research on high-temperature insulation materials.