In X-band T/R module, the number, length, arch height, span, solder joint position and other parameters of gold bonding wires will have a serious impact on the microwave transmission characteristics. Through the automatic detection technology to achieve the automatic detection of the above parameters, we can infer whether the bonding quality of X-band T/R module is qualified. In this paper, based on the focus variation measurement technology, the micron scale parameter measurement of the gold bonding wires is realized, and the relative error of the measurement result is less than 0.7%. In this method, a group of images of the gold bonding wires are obtained through the self-designed image acquisition platform, and then the arch height and span of the gold bonding wires are measured through image processing technologies such as multi focus image fusion and focus evaluation. This technology is helpful to improve the detection efficiency of gold wire bonding products and the production efficiency of X-band T/R module.